Reflow soldering technology in the field of electronics manufacturing is not strange, we use computer in the various components on the board is welded on the circuit board through this process, the device's internal have a heating circuit, heated to a high enough temperature to air or nitrogen after blowing has good components of circuit boards, components on both sides of the solder melts and motherboard bonding.The advantages of this process are that the temperature is easily controlled, oxidation is avoided during welding, and manufacturing costs are more easily controlled.
Due to the need of electronic products PCB board miniaturization, the emergence of chip components, traditional welding methods can not meet the needs.At first, reflow soldering process was only used in the assembly of HYBRID integrated circuit board. Most components assembled and welded were chip capacitor, chip inductor, chip transistor and diode, etc.With the development of SMT technology, the emergence of a variety of SMT components (SMC) and SMD devices, as a part of the SMT reflow welding technology and equipment have also been developed accordingly, its application is becoming more and more widespread, almost in all the fields of electronic products have been applied